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ULS Industries Sdn Bhd
17, Jalan Industri TMP5,
Taman Perindustries Tanjung Minyak Perdana,
75250 Melaka, Malaysia.
+6012-306 4757

UV Dicing Tape

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  • Ideal for protecting & fixing wafer in dicing processes.
  • Low adhesive strength allows easy peel after UV radiation.
  • No chip damage and contamination in die pick up.
  • Total thickness (um):90+5
  • Adhesion (g/25mm) : before UV -110+10, After UV -5+2
  • Max width: 1000mm


Manufactured by ULS

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